US 11,751,367 B2
Microelectronic package electrostatic discharge (ESD) protection
Veronica Aleman Strong, Hillsboro, OR (US); Johanna M. Swan, Scottsdale, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); Adel A. Elsherbini, Tempe, AZ (US); and Feras Eid, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 7, 2021, as Appl. No. 17/468,510.
Application 17/468,510 is a continuation of application No. 16/659,459, filed on Oct. 21, 2019, granted, now 11,147,197.
Prior Publication US 2021/0410343 A1, Dec. 30, 2021
Int. Cl. H05K 9/00 (2006.01); H01L 23/60 (2006.01); H01L 21/48 (2006.01); C08G 61/12 (2006.01); C08G 73/06 (2006.01); C08G 85/00 (2006.01); H01L 23/498 (2006.01)
CPC H05K 9/0079 (2013.01) [C08G 61/126 (2013.01); C08G 73/0611 (2013.01); C08G 85/004 (2013.01); H01L 21/4867 (2013.01); H01L 23/60 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/514 (2013.01); C08G 2261/78 (2013.01); H01L 23/498 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic package comprising:
a die; and
a package substrate coupled to the die with a first interconnect on a first face, wherein the package substrate comprises:
a second interconnect and a third interconnect on a second face opposite to the first face;
a conductive signal path between the first interconnect and the second interconnect;
a conductive ground path between the second interconnect and the third interconnect; and
an electrostatic discharge (ESD) protection material coupled to the conductive ground path, the ESD protection material comprising a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer that is chemically bonded to the first functional group and the second functional group permitting an electrical signal to pass between the first and second electrically-conductive carbon allotropes.