US 11,751,357 B2
Apparatus including thermal management mechanism and methods of manufacturing the same
Suresh Reddy Yarragunta, Bangalore (IN); and Deepu Narasimiah Subhash, Bangalore (IN)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Apr. 15, 2021, as Appl. No. 17/231,994.
Prior Publication US 2022/0338378 A1, Oct. 20, 2022
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20409 (2013.01) [G06F 1/20 (2013.01); H05K 7/20009 (2013.01); H05K 7/20436 (2013.01); H05K 7/20509 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a substrate;
a set of electronic components attached over the substrate; and
a heat sink attached to the set of electronic components and configured to remove thermal energy away from the set of electronic components, wherein the heat sink includes
a first base portion and a second base portion attached to the set of electronic components and configured to remove the thermal energy away from the electronic components, the first and second base portions each having a planar surface opposite the set of electronic components, wherein the first and second base portions are physically separate and arranged serially along a flow direction extending from a first edge of the heat sink to a second edge of the heat sink opposite the first edge, and
a set of fins extending (1) perpendicularly away from the planar surfaces of the first and second base portions and (2) along or parallel to the flow direction, wherein the set of fins define at least:
a first set of flow channels over the first base portion and corresponding to a first width, and
over the second base portion, a second set of flow channels that (a) correspond to a second width different from the first width and (b) are located farther away from the first edge than the first set of flow channels;
a top cover directly contacting and thermally coupled to the set of fins, the top cover having dissipation fins that are (1) attached to or integral with the top cover and (2) located past the second peripheral edge along the flow direction.