US 11,751,340 B2
Method of producing wiring board that includes dual-layered insulating film
Akitoshi Sakaue, Tokyo (JP)
Assigned to JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, Tokyo (JP)
Filed by JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, Tokyo (JP)
Filed on Dec. 10, 2021, as Appl. No. 17/547,576.
Claims priority of application No. 2021-001224 (JP), filed on Jan. 7, 2021.
Prior Publication US 2022/0217850 A1, Jul. 7, 2022
Int. Cl. H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01)
CPC H05K 3/46 (2013.01) [H05K 1/0298 (2013.01); H05K 3/10 (2013.01); H05K 2203/0502 (2013.01); Y10T 29/49147 (2015.01)] 4 Claims
OG exemplary drawing
 
1. A method of producing a wiring board that comprises a board, a conductor pattern on the board, and an insulating film covering at least part of the conductor pattern, the method comprising:
transferring first ink of insulating film material from a first flexographic plate onto the board so that the first ink of insulating film material is provided in a first region covering said at least part of the conductor pattern on the board, the first region having a first border segment;
curing the first ink of insulating film material provided in the first region;
transferring second ink of insulating film material from a second flexographic plate onto the board so that the second ink of insulating film material is provided in a second region covering at least part of the first region on the board, the second region having a second border segment that is located beyond the first region, wherein a shortest distance between the first border segment and any point belonging to the second border segment is not less than 50 μm and not greater than 400 μm; and
curing the second ink of insulating film material provided in the second region, whereby the insulating film is gained as a combination of cured products of the first ink of insulating film material and the second ink of insulating film material.