US 11,751,335 B2
Printed circuit board
So Ree Yoo, Suwon-si (KR); Seung Eun Lee, Suwon-si (KR); Joo Hwan Jung, Suwon-si (KR); and Yong Hoon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 25, 2022, as Appl. No. 17/583,582.
Claims priority of application No. 10-2021-0161514 (KR), filed on Nov. 22, 2021.
Prior Publication US 2023/0164921 A1, May 25, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/185 (2013.01) [H05K 1/112 (2013.01); H05K 1/183 (2013.01); H05K 2201/096 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first substrate including a first cavity and first circuit units; and
a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units,
wherein the second substrate includes a first region and a second region,
the first region of the second substrate includes an outermost circuit layer among the second circuit units,
circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate, and
along a stacking direction of the circuit layers, the second circuit units overlap the electronic component.