US 11,751,319 B2
Electronic device
Hyunwoo Chung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Appl. No. 17/257,373
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
PCT Filed Mar. 21, 2019, PCT No. PCT/KR2019/003302
§ 371(c)(1), (2) Date Dec. 31, 2020,
PCT Pub. No. WO2020/022607, PCT Pub. Date Jan. 30, 2020.
Claims priority of application No. 10-2018-0086742 (KR), filed on Jul. 25, 2018.
Prior Publication US 2021/0136910 A1, May 6, 2021
Int. Cl. H05K 9/00 (2006.01); H05K 1/02 (2006.01); F21V 8/00 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0216 (2013.01) [G02B 6/0051 (2013.01); G02B 6/0088 (2013.01); H05K 1/182 (2013.01); H05K 9/0033 (2013.01); H05K 2201/10189 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
a printed circuit board comprising at least one through-hole;
a holder which is positioned through the through-hole and protrudes upward and downward from the printed circuit board; and
a solder layer configured to bond one area of the holder to one surface of the printed circuit board,
wherein the holder comprises:
a lower holder that passes through the through-hole to be disposed on a lower portion of the printed circuit board, and protrudes downward from the printed circuit board;
an upper holder that protrudes upward from the printed circuit board; and
a connecting member that has a width that is wider than a diameter of the through-hole and is connected the upper holder and the lower holder.