US 11,751,288 B2
Heat-emitting transparent plate, method of manufacturing the heat-emitting transparent plate, heat-emitting device including the heat-emitting transparent plate and objects including the heat-emitting device
Junghyun Park, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 13, 2019, as Appl. No. 16/713,254.
Claims priority of application No. 10-2018-0162154 (KR), filed on Dec. 14, 2018.
Prior Publication US 2020/0196391 A1, Jun. 18, 2020
Int. Cl. H05B 1/02 (2006.01); F21V 7/00 (2006.01); F21V 5/00 (2018.01); H05B 6/46 (2006.01); F21W 107/10 (2018.01)
CPC H05B 1/0236 (2013.01) [F21V 5/00 (2013.01); F21V 7/00 (2013.01); H05B 6/46 (2013.01); F21W 2107/10 (2018.01); H05B 2203/017 (2013.01)] 42 Claims
OG exemplary drawing
 
1. A heat-emitting transparent plate comprising:
a heat-emitting region that is transparent to visible light and configured to emit heat by absorbing infrared rays,
wherein the heat-emitting region comprises a meta-surface,
wherein the meta-surface comprises a plurality of meta-patterns configured to absorb the infrared rays, and
wherein the plurality of meta-patterns comprise:
a plurality of first meta-patterns; and
a plurality of second meta-patterns different from the plurality of first meta-patterns.