US 11,750,981 B2
Transducer and method for manufacturing same
Katsuhiko Nakano, Aichi (JP); Masaki Nasu, Aichi (JP); Koichi Hasegawa, Aichi (JP); and Shinya Tahara, Aichi (JP)
Assigned to Sumitomo Riko Company Limited, Aichi (JP)
Filed by Sumitomo Riko Company Limited, Aichi (JP)
Filed on Oct. 8, 2019, as Appl. No. 16/595,522.
Application 16/595,522 is a continuation of application No. PCT/JP2018/036242, filed on Sep. 28, 2018.
Claims priority of application No. 2017-191447 (JP), filed on Sep. 29, 2017; application No. 2017-251418 (JP), filed on Dec. 27, 2017; application No. 2018-124273 (JP), filed on Jun. 29, 2018; and application No. 2018-170510 (JP), filed on Sep. 12, 2018.
Prior Publication US 2020/0053482 A1, Feb. 13, 2020
Int. Cl. B06B 1/02 (2006.01); G01D 5/241 (2006.01); B60R 21/015 (2006.01); H04R 19/00 (2006.01); B62D 1/04 (2006.01); B62D 1/06 (2006.01); H10N 30/857 (2023.01); H10N 30/87 (2023.01)
CPC H04R 19/00 (2013.01) [B60R 21/01552 (2014.10); B62D 1/046 (2013.01); B62D 1/065 (2013.01); H10N 30/857 (2023.02); H10N 30/877 (2023.02)] 26 Claims
OG exemplary drawing
 
1. A sensor comprising:
a first electrode sheet provided with a plurality of first through-holes;
a dielectric layer with a first surface that is disposed on a side of the first electrode sheet, wherein the dielectric layer is formed from a thermoplastic material; and
a first fusion-bonding layer formed from a fusion-bonding material, wherein the first fusion-bonding layer joining together, by fusion-bonding of the fusion-bonding material, a boundary region between a body portion of the dielectric layer and a first inner surface of the first electrode sheet and a boundary region between the body portion of the dielectric layer and a first inner circumferential surface of at least some of the plurality of first through-holes,
the first fusion-bonding layer applies a part of the dielectric layer as the fusion-bonding material and bonds the respective boundary regions through fusion-bonding of the part of the dielectric layer, and
the first fusion-bonding layer is formed from the same material constituent as that of the dielectric layer, and, wherein the first fusion-bonding layer blocks the plurality of first through-holes.