US 11,750,170 B2
Guided SAW device
Shogo Inoue, Longwood, FL (US); and Marc Solal, Longwood, FL (US)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Filed by Qorvo US, Inc., Greensboro, NC (US)
Filed on Nov. 19, 2020, as Appl. No. 16/952,409.
Application 16/952,409 is a continuation of application No. 15/784,592, filed on Oct. 16, 2017, granted, now 10,848,121.
Claims priority of provisional application 62/408,405, filed on Oct. 14, 2016.
Prior Publication US 2021/0075394 A1, Mar. 11, 2021
Int. Cl. H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/02566 (2013.01) [H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/14564 (2013.01); H03H 9/6433 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A guided surface acoustic wave (SAW) device comprising:
a silicon substrate having a crystalline orientation defined by a first Euler angle (ϕ), a second Euler angle (θ), and a third Euler angle (ψ), wherein the first Euler angle (ϕ), the second Euler angle (θ), and the third Euler angle (ψ) such that a velocity of wave propagation within the substrate is less than 6,000 m/s;
a piezoelectric layer on the silicon substrate; and
a transducer on the piezoelectric layer.