US 11,749,923 B2
Cooling system for socket connector
Brian Patrick Costello, Scotts Valley, CA (US); and Alex Michael Sharf, Harrisburg, PA (US)
Assigned to TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen (CH)
Filed by TE Connectivity Services GmbH, Schaffhausen (CH)
Filed on Apr. 15, 2021, as Appl. No. 17/231,040.
Prior Publication US 2022/0336982 A1, Oct. 20, 2022
Int. Cl. H01R 12/82 (2011.01); H01R 13/52 (2006.01)
CPC H01R 12/82 (2013.01) [H01R 13/5202 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
a host circuit board having an upper surface and board contacts on the upper surface, the upper surface having a mounting area;
a socket connector mounted to the host circuit board at the mounting area, the socket connector including a socket housing holding a plurality of socket contacts, each socket contact having an upper contact portion and a lower contact portion, the lower contact portion being electrically connected to the corresponding board contact of the host circuit board, the socket contact being compressible between the upper contact portion and the lower contact portion, the socket housing including coolant channels configured to receive liquid coolant, the coolant channels being open through the socket housing to allow liquid coolant flow through the socket housing; and
an electronic package coupled to the socket connector, the electronic package having a lower surface and package contacts on the lower surface, the package contacts being electrically connected to the upper contact portions of the socket contacts.