US 11,749,918 B2
Circuit device
Hsin-Tuan Hsiao, New Taipei (TW); Yi-Hsing Chung, New Taipei (TW); and Ting-Jhen Pan, New Taipei (TW)
Assigned to BIZLINK INTERNATIONAL CORP., New Taipei (TW)
Filed by BIZLINK INTERNATIONAL CORP., New Taipei (TW)
Filed on Jul. 23, 2021, as Appl. No. 17/383,624.
Claims priority of application No. 109209765 (TW), filed on Jul. 30, 2020.
Prior Publication US 2022/0037815 A1, Feb. 3, 2022
Int. Cl. H01R 12/00 (2006.01); H01R 12/53 (2011.01); H01R 12/57 (2011.01); H01R 107/00 (2006.01)
CPC H01R 12/53 (2013.01) [H01R 12/57 (2013.01); H01R 2107/00 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A circuit device comprising:
a circuit board;
at least one contact pad mounted on the circuit board and electrically connected with the circuit board; each contact pad comprises at least one opening; and
at least one cable, comprising at least one wire respectively, the wire mounted on and electrically connected with the contact pad, the wire covering at least part of the opening of the contact pad thereby forming an air gap between the wire and the circuit board, the wire configured to transmit signals.