US 11,749,880 B2
Electronic device including high-frequency transmission circuit
Han-Min Cho, Gyeonggi-do (KR); Chan-Gi Park, Gyeonggi-do (KR); Yeon-Sang Yun, Gyeonggi-do (KR); Tae-Wook Ham, Gyeonggi-do (KR); Hei-Seong Kwak, Gyeonggi-do (KR); Byoung-Il Son, Gyeonggi-do (KR); and Sung-Chul Park, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Dec. 28, 2022, as Appl. No. 18/90,214.
Application 17/225,509 is a division of application No. 16/939,708, filed on Jul. 27, 2020, granted, now 10,978,789, issued on Apr. 13, 2021.
Application 18/090,214 is a continuation of application No. 17/225,509, filed on Apr. 8, 2021, granted, now 11,569,565.
Application 16/939,708 is a continuation of application No. 15/621,687, filed on Jun. 13, 2017, granted, now 10,727,568, issued on Jul. 28, 2020.
Claims priority of application No. 10-2016-0073355 (KR), filed on Jun. 13, 2016.
Prior Publication US 2023/0134315 A1, May 4, 2023
Int. Cl. H01Q 1/24 (2006.01); H01Q 5/35 (2015.01); H05K 1/02 (2006.01); H01Q 21/28 (2006.01); H01Q 1/38 (2006.01); H01R 12/79 (2011.01); H01R 13/66 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01)
CPC H01Q 1/243 (2013.01) [H01Q 1/38 (2013.01); H01Q 5/35 (2015.01); H01Q 21/28 (2013.01); H01R 12/79 (2013.01); H01R 13/6691 (2013.01); H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 1/142 (2013.01); H05K 1/148 (2013.01); H05K 1/18 (2013.01); H05K 7/1427 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10098 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A portable communication device comprising:
a housing;
a first printed circuit board (PCB) disposed in the housing;
a wireless communication circuit mounted on the first PCB; and
a second PCB including:
a connection part connected with the first PCB;
a first PCB portion extended from the connection part and having greater flexibility than the connection part;
a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion;
a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion;
a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion;
a signal line extended to the connection part along the first, second, third, and fourth PCB portions; and
vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion,
wherein a portion of the signal line is located between some of the vias.