CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01); H05K 1/181 (2013.01); H05K 3/0008 (2013.01); H05K 3/0047 (2013.01); H05K 3/321 (2013.01); H05K 3/3431 (2013.01); H05K 3/3494 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/166 (2013.01)] | 20 Claims |
1. A method of forming a Light Emitting Diode (LED) assembly, the method comprising:
drilling a first through hole in a printed circuit board, wherein the first through hole attaches the printed circuit board to a housing;
determining a first fiducial based on the first through hole on the printed circuit board,
wherein the first fiducial is used to determine a LED module placement accuracy within the printed circuit board;
after determining the first fiducial, determining, using a plurality of images of a LED module, a center of a LED emitter of the LED module, wherein the LED is integral to the LED module and the center of the LED emitter is different than a center of the LED module;
placing the LED module on the printed circuit board based on the first fiducial and the center of the LED emitter of the LED module.
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