CPC H01L 33/504 (2013.01) [H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 33/0095 (2013.01); H01L 2933/0041 (2013.01)] | 18 Claims |
1. A method for making a light emitting apparatus, the method comprising:
positioning on a semiconductor LED array comprising multiple semiconductor LED pixels a first set of phosphor pixels arranged on a carrier substrate, with each phosphor pixel of the first set aligned with a corresponding semiconductor LED pixel of the array, the phosphor pixels of the first set having a layer of thermally curable adhesive, in an uncured state, on a surface thereof opposite the carrier substrate so that a corresponding segment of the adhesive is between and in contact with each phosphor pixel of the first set and a light output surface of the corresponding semiconductor LED pixel; and
electrically operating selected ones of the semiconductor LED pixels to emit light and to heat the corresponding phosphor pixels to a temperature that at least partially cures corresponding discrete segments of the adhesive and bonds each one of the selected semiconductor LED pixels to the corresponding phosphor pixel of the first set.
|