CPC H01L 33/504 (2013.01) [H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 33/0095 (2013.01); H01L 2933/0041 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a semiconductor LED array comprising multiple semiconductor LED pixels;
a first set of multiple phosphor pixels, (i) each phosphor pixel of the first set being positioned over a light emitting surface of a corresponding LED pixel of a first subset of the LED pixels and attached to that corresponding LED pixel by a thermally curable adhesive in a cured state, (ii) a second subset of the LED pixels having no corresponding phosphor pixel of the first set attached thereto; and
a second set of multiple phosphor pixels arranged on a carrier substrate, each phosphor pixel of the second set having a corresponding layer of the thermally curable adhesive, in an uncured state, on a surface of the phosphor pixel opposite the carrier substrate,
the phosphor pixels of the first and second sets being arranged on the LED array and the carrier substrate, respectively, so that with the LED array and the carrier substrate suitably aligned substantially parallel to each other with the light emitting surfaces of the LED pixels facing the phosphor pixels of the second set, (i) each phosphor pixel of the first set is aligned with a corresponding area of the carrier substrate that lacks a phosphor pixel of the second set, and (ii) each phosphor pixel of the second set is aligned with a corresponding one of the LED pixels that lacks a phosphor pixel of the first set.
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