US 11,749,777 B2
Method for manufacturing light-emitting module
So Sakamaki, Tokushima (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Apr. 27, 2020, as Appl. No. 16/859,039.
Claims priority of application No. 2019-086910 (JP), filed on Apr. 27, 2019.
Prior Publication US 2020/0343408 A1, Oct. 29, 2020
Int. Cl. H01L 33/00 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/0095 (2013.01) [H01L 25/0753 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for manufacturing a light-emitting module, comprising:
placing a light-emitting element on a support member with an electrode formation surface of the light-emitting element facing upward, the electrode formation surface including a pair of positive and negative element electrodes at a same surface side, the light-emitting element having the electrode formation surface and a light-emitting surface at a side opposite to the electrode formation surface;
forming a pair of first conductive members respectively on the element electrodes;
forming a first light-reflective resin layer on the support member and around the light-emitting element and the first conductive members;
forming a pair of second conductive members on the first light-reflective resin layer and respectively on the first conductive members, the second conductive member being wider than the first conductive member;
forming a second light-reflective resin layer on the first light-reflective resin layer and around the second conductive members;
forming wiring electrodes over the second light-reflective resin layer from the second conductive members;
bonding a substrate on the second light-reflective resin layer; and
removing the support member after bonding the substrate on the second light-reflective resin layer.