CPC H01L 33/0095 (2013.01) [H01L 25/0753 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] | 18 Claims |
1. A method for manufacturing a light-emitting module, comprising:
placing a light-emitting element on a support member with an electrode formation surface of the light-emitting element facing upward, the electrode formation surface including a pair of positive and negative element electrodes at a same surface side, the light-emitting element having the electrode formation surface and a light-emitting surface at a side opposite to the electrode formation surface;
forming a pair of first conductive members respectively on the element electrodes;
forming a first light-reflective resin layer on the support member and around the light-emitting element and the first conductive members;
forming a pair of second conductive members on the first light-reflective resin layer and respectively on the first conductive members, the second conductive member being wider than the first conductive member;
forming a second light-reflective resin layer on the first light-reflective resin layer and around the second conductive members;
forming wiring electrodes over the second light-reflective resin layer from the second conductive members;
bonding a substrate on the second light-reflective resin layer; and
removing the support member after bonding the substrate on the second light-reflective resin layer.
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