CPC H01L 29/0619 (2013.01) [H01L 27/0886 (2013.01); H01L 29/42392 (2013.01); H01L 29/78696 (2013.01)] | 20 Claims |
1. An integrated circuit (IC) component, comprising:
a first region comprising semiconductor materials, the first region including first layers alternating with second layers, individual ones of the first layers comprising a different semiconductor material from individual ones of the second layers; and
a second region comprising semiconductor materials, the second region including third layers alternating with fourth layers, individual ones of the third layers comprising a different semiconductor material from individual ones of the fourth layers,
wherein individual ones of the third layers and the fourth layers are thicker than individual ones of the first layers and the second layers.
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