US 11,749,691 B2
Electronic device substrate, manufacturing method thereof, and electronic device
Kui Zhang, Beijing (CN); Pengcheng Lu, Beijing (CN); Li Liu, Beijing (CN); Yunlong Li, Beijing (CN); and Dacheng Zhang, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Jun. 23, 2022, as Appl. No. 17/847,877.
Application 17/847,877 is a continuation of application No. 16/959,398, granted, now 11,404,451, previously published as PCT/CN2019/102819, filed on Aug. 27, 2019.
Prior Publication US 2022/0336503 A1, Oct. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/12 (2006.01)
CPC H01L 27/1244 (2013.01) [H01L 27/1259 (2013.01)] 19 Claims
OG exemplary drawing
 
5. An electronic device substrate, comprising a base substrate, a first insulating layer, a plurality of light-emitting sub-units, a first conductive member, a second conductive member, and a third conductive member,
wherein the plurality of light-emitting sub-units are in an array region of the electronic device substrate, the first conductive member is in a periphery region, surrounding the array region, of the electronic device substrate, and the second conductive member is between the first conductive member and the array region;
each of the plurality of light-emitting sub-units comprises a first driving electrode and a second driving electrode, and the first driving electrode and the second driving electrode are configured to apply a light-emitting driving voltage;
the third conductive member is on the side of the first insulating layer away from the base substrate;
the third conductive member surrounds the array region, and the second conductive member surrounds the third conductive member;
each of the plurality of light-emitting sub-units comprises a light-emitting layer, and light-emitting layers of the plurality of light-emitting sub-units are integrated to form a light-emitting material layer; and
the light-emitting material layer extends onto the third conductive member and at least partially overlaps with the third conductive member.