US 11,749,675 B2
Semiconductor device
Seiji Momota, Kawasaki (JP); Hitoshi Abe, Kawasaki (JP); Takashi Shiigi, Kawasaki (JP); Takeshi Fujii, Kawasaki (JP); Koh Yoshikawa, Kawasaki (JP); Tetsutaro Imagawa, Kawasaki (JP); Masaki Koyama, Kariya (JP); and Makoto Asai, Kariya (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP); and DENSO CORPORATION, Kariya (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP); and DENSO CORPORATION, Kariya (JP)
Filed on Jan. 7, 2021, as Appl. No. 17/143,247.
Application 17/143,247 is a division of application No. 15/255,713, filed on Sep. 2, 2016, granted, now 10,916,541.
Application 15/255,713 is a division of application No. 12/865,330, granted, now 9,466,711, previously published as PCT/JP2009/051328, filed on Jan. 28, 2009.
Claims priority of application No. 2008-018050 (JP), filed on Jan. 29, 2008; and application No. 2008-160800 (JP), filed on Jun. 19, 2008.
Prior Publication US 2021/0134789 A1, May 6, 2021
Int. Cl. H01L 27/06 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01)
CPC H01L 27/0629 (2013.01) [H01L 27/0658 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01); H01L 29/7815 (2013.01); H01L 29/0696 (2013.01); H01L 29/0878 (2013.01); H01L 29/1095 (2013.01); H01L 29/4236 (2013.01); H01L 29/7827 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A semiconductor device that detects current in a main insulated-gate semiconductor device element by a potential difference, the semiconductor device, comprising:
the main insulated-gate semiconductor device element;
a current-detecting insulated-gate semiconductor device element having a size smaller than a size of the main insulated-gate semiconductor device element; and
a resistor connected between the main insulated-gate semiconductor device element and the current-detecting insulated-gate semiconductor device element, the resistor having the potential difference between ends thereof, wherein
the current-detecting insulated-gate semiconductor device element, under reverse bias, has a breakdown voltage higher than a breakdown voltage of the main insulated-gate semiconductor device element under reverse bias,
the main insulated-gate semiconductor device element has:
a first first-conductivity-type semiconductor layer having a first main surface and a second main surface opposite to each other,
a first second-conductivity-type semiconductor region provided in the first first-conductivity-type semiconductor layer at the first main surface,
a first first-conductivity-type high-concentration semiconductor region selectively provided in the first second-conductivity-type semiconductor region at a surface of the first second-conductivity-type semiconductor region,
a first gate electrode provided, via a first gate insulating film, in a first trench that penetrates the first first-conductivity-type high-concentration semiconductor region and the first second-conductivity-type semiconductor region and reaches the first first-conductivity-type semiconductor layer,
a first electrode in contact with the first first-conductivity-type high-concentration semiconductor region and the first second-conductivity-type semiconductor region, and
a second electrode provided facing the second main surface of the first first-conductivity-type semiconductor layer, and
the current-detecting insulated-gate semiconductor device element has:
a second first-conductivity-type semiconductor layer having a first main surface and a second main surface opposite to each other,
a second second-conductivity-type semiconductor region provided in the second first-conductivity-type semiconductor layer at the first main surface of the second first-conductivity-type semiconductor layer,
a second first-conductivity-type high-concentration semiconductor region selectively provided in the second second-conductivity-type semiconductor region at a surface of the second second-conductivity-type semiconductor region,
a second gate electrode provided, via a second gate insulating film, in a second trench that penetrates the second first-conductivity-type high-concentration semiconductor region and the second second-conductivity-type semiconductor region and reaches the second first-conductivity-type semiconductor layer,
a third electrode in contact with the second first-conductivity-type high-concentration semiconductor region and the second second-conductivity-type semiconductor region, and
a fourth electrode provided facing the second main surface of the second first-conductivity-type semiconductor layer.