US 11,749,652 B2
Method of repairing light emitting device and display panel having repaired light emitting device
Jong Hyeon Chae, Ansan-si (KR); Ik Kyu You, Ansan-si (KR); Seom Geun Lee, Ansan-si (KR); Seong Kyu Jang, Ansan-si (KR); and Yong Woo Ryu, Ansan-si (KR)
Assigned to SEOUL VIOSYS CO., LTD., Ansan-si (KR)
Filed by SEOUL VIOSYS CO., LTD., Ansan-si (KR)
Filed on Nov. 20, 2022, as Appl. No. 17/990,735.
Application 17/990,735 is a continuation of application No. 17/121,651, filed on Dec. 14, 2020, granted, now 11,508,704.
Claims priority of provisional application 62/991,189, filed on Mar. 18, 2020.
Claims priority of provisional application 62/949,096, filed on Dec. 17, 2019.
Prior Publication US 2023/0081487 A1, Mar. 16, 2023
Int. Cl. H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01)
CPC H01L 25/0753 (2013.01) [H01L 24/16 (2013.01); H01L 33/62 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16505 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a circuit board having first pads;
a plurality of light emitting devices disposed on the circuit board and having second pads, the light emitting devices including at least one first light emitting device configured to emit light having a first peak wavelength and second light emitting devices configured to emit light having a second peak wavelength; and
a metal bonding layer electrically connecting the first pads and the second pads,
wherein the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices,
wherein the metal bonding layer of the first light emitting device includes a same material as that of the metal bonding layer of the second light emitting devices, and
wherein an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.