CPC H01L 24/743 (2013.01) [G09F 9/33 (2013.01); H01L 21/67144 (2013.01); H01L 24/83 (2013.01); H01L 33/0095 (2013.01); H05K 13/04 (2013.01); H05K 13/0404 (2013.01); H01L 2924/06 (2013.01); H01L 2924/12041 (2013.01)] | 15 Claims |
1. An apparatus for separating-at least one of a plurality of device chips adhered to a first adhesive layer of a first substrate from the first substrate by rotating a first drum and for transferring the at least one of the plurality of device chips onto a second adhesive layer of a second substrate, the apparatus comprising:
a first conveying table for conveying the first substrate;
a second conveying table for conveying the second substrate;
a traveling guide along which the first conveying table and the second conveying table move,
the first drum that is rotatable; and
a third adhesive layer located on the first drum,
wherein the first drum is configured to separate the at least one of the plurality of device chips from the first adhesive layer of the first substrate and adhere the at least one of the plurality of device chips to the third adhesive layer by rotating the first drum, and configured to separate the at least one of the plurality of device chips from the third adhesive layer by rotating the first drum.
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