US 11,749,634 B2
Semiconductor device and wire bonding method
Kazuya Maruyama, Higashikurume (JP); Tsutomu Sano, Yokohama (JP); and Junichi Saijo, Suzuka (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Jan. 6, 2021, as Appl. No. 17/142,363.
Claims priority of application No. 2020-000795 (JP), filed on Jan. 7, 2020.
Prior Publication US 2021/0210457 A1, Jul. 8, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/45 (2013.01) [H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 25/0652 (2013.01); H01L 2224/45032 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/85205 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first electrode;
a second electrode;
a wire extending between the first electrode and the second electrode; and
an insulator configured to seal the first electrode, the second electrode, and the wire,
wherein the wire includes:
a first conductor in contact with the first electrode and the second electrode;
a second conductor that is provided inside the first conductor, has no contact with the first electrode and the second electrode, and is different from the first conductor;
a first portion in contact with the first electrode;
a second portion in contact with the second electrode;
a third portion between a first side of the first portion and the second portion; and
a fourth portion in a second side of the first portion different from the first side, wherein
the first portion of the wire and the second portion of the wire have diameters ranging from ⅕ to ½ of a diameter of the third portion of the wire,
the first conductor and the second conductor are in contact with the insulator in the fourth portion, and
a thickness of the first conductor is constant over the fourth portion, the first portion, the third portion, and the second portion.