US 11,749,617 B2
Package structure and method for fabricating the same
Harry-Hak-Lay Chuang, Hsinchu County (TW); Chia-Hsiang Chen, Hsinchu (TW); Meng-Chun Shih, Hsinchu (TW); Ching-Huang Wang, Taoyuan County (TW); and Tien-Wei Chiang, Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Jun. 30, 2022, as Appl. No. 17/854,022.
Application 17/854,022 is a continuation of application No. 17/079,325, filed on Oct. 23, 2020, granted, now 11,380,626.
Application 17/079,325 is a continuation of application No. 16/034,865, filed on Jul. 13, 2018, granted, now 10,818,609, issued on Oct. 27, 2020.
Prior Publication US 2022/0328423 A1, Oct. 13, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/85035 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a mounting pad having a mounting surface;
a semiconductor chip disposed on the mounting surface of the mounting pad,
wherein the semiconductor chip comprises:
a first surface;
a second surface opposite to the first surface and facing the mounting surface; and
a third surface connecting the first surface and the second surface;
a first magnetic field shielding, comprising:
a first portion proximal to the third surface of the semiconductor chip, wherein the first portion has a first height calculated from the mounting surface to a top surface; and
a second portion distal to the semiconductor chip, has a second height calculated from the mounting surface to a position at a surface facing away from the mounting surface, wherein the second height is less than the first height, wherein the second portion has an inclined sidewall.