CPC H01L 23/5381 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/16235 (2013.01)] | 20 Claims |
1. A method of manufacturing a package, comprising:
providing a first die and a second die disposed side by side;
mounting a bridge structure to the first die and the second die in a flip-chip bonding;
forming an encapsulant to encapsulate the first die, the second die, and the bridge structure;
performing a planarization process to thin the bridge structure, remove a portion of the encapsulant, and expose a backside of the bridge structure;
forming a plurality of openings in a substrate of the bridge structure; and
forming a plurality of through vias in the plurality of openings respectively and forming a plurality of redistribution layers (RDLs) over the plurality of through vias.
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