US 11,749,607 B2
Package and method of manufacturing the same
Chih-Wei Wu, Yilan County (TW); Chen-Hua Yu, Hsinchu (TW); Kuo-Chung Yee, Taoyuan (TW); Szu-Wei Lu, Hsinchu (TW); and Ying-Ching Shih, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 27, 2022, as Appl. No. 17/705,373.
Application 17/705,373 is a division of application No. 16/655,260, filed on Oct. 17, 2019, granted, now 11,289,424.
Claims priority of provisional application 62/773,105, filed on Nov. 29, 2018.
Prior Publication US 2022/0216152 A1, Jul. 7, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5381 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/16235 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a package, comprising:
providing a first die and a second die disposed side by side;
mounting a bridge structure to the first die and the second die in a flip-chip bonding;
forming an encapsulant to encapsulate the first die, the second die, and the bridge structure;
performing a planarization process to thin the bridge structure, remove a portion of the encapsulant, and expose a backside of the bridge structure;
forming a plurality of openings in a substrate of the bridge structure; and
forming a plurality of through vias in the plurality of openings respectively and forming a plurality of redistribution layers (RDLs) over the plurality of through vias.