CPC H01L 23/5258 (2013.01) [H01L 21/76843 (2013.01); H01L 23/573 (2013.01); H01L 23/62 (2013.01); H01L 24/16 (2013.01)] | 20 Claims |
1. A method comprising: depositing an insulator material on an underlying substrate; patterning the insulator material to form adjacent openings in the insulator material thereby exposing the underlying substrate; patterning the insulator material which recesses an upper portion of the insulator material between the adjacent openings to form a single bump that extends into each of and is between the adjacent openings in the insulator material; depositing conductive material over the single bump and in the adjacent openings; and planarizing the conductive material to form a continuous wiring structure comprising a thin laser fuse portion and thicker overpass wiring structure on a same wiring level.
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