US 11,749,596 B2
Wiring substrate
Katsuyuki Sano, Ogaki (JP); and Yoji Sawada, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on Oct. 25, 2021, as Appl. No. 17/452,123.
Claims priority of application No. 2020-193599 (JP), filed on Nov. 20, 2020.
Prior Publication US 2022/0165653 A1, May 26, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wiring substrate, comprising:
a conductor pad;
an insulating layer formed on the conductor pad such that the insulating layer is covering the conductor pad and has a through hole; and
a bump formed on the conductor pad such that the bump is formed in the through hole penetrating through the insulating layer,
wherein the conductor pad is formed such that the conductor pad has a connecting surface connected to the bump, a concave part formed on the connecting surface of the conductor pad to the bump, and a convex part formed in the concave part.