CPC H01L 23/49811 (2013.01) [H01L 23/3121 (2013.01); H01L 23/3185 (2013.01); H01L 23/49822 (2013.01); H01L 23/60 (2013.01); H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48225 (2013.01)] | 15 Claims |
1. A module comprising:
a substrate including a first main surface;
a first component mounted on the first main surface;
a first land electrode on the first main surface;
a first mold resin that covers at least the first main surface and the first component;
a top surface shield film that covers a top surface of the first mold resin;
a side surface shield film that covers a side surface of the first mold resin;
a first conductor pillar in the first mold resin to electrically connect the first land electrode and the top surface shield film; and
an upper first bypass conductor in the first mold resin to electrically connect the top surface shield film and the side surface shield film.
|