US 11,749,589 B2
Module
Kazushige Sato, Nagaokakyo (JP); and Masayoshi Takagi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on May 24, 2021, as Appl. No. 17/327,821.
Application 17/327,821 is a continuation of application No. PCT/JP2019/042560, filed on Oct. 30, 2019.
Claims priority of application No. 2018-225583 (JP), filed on Nov. 30, 2018.
Prior Publication US 2021/0280503 A1, Sep. 9, 2021
Int. Cl. H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/60 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 23/3121 (2013.01); H01L 23/3185 (2013.01); H01L 23/49822 (2013.01); H01L 23/60 (2013.01); H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48225 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate including a first main surface;
a first component mounted on the first main surface;
a first land electrode on the first main surface;
a first mold resin that covers at least the first main surface and the first component;
a top surface shield film that covers a top surface of the first mold resin;
a side surface shield film that covers a side surface of the first mold resin;
a first conductor pillar in the first mold resin to electrically connect the first land electrode and the top surface shield film; and
an upper first bypass conductor in the first mold resin to electrically connect the top surface shield film and the side surface shield film.