CPC H01L 23/4334 (2013.01) [H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01)] | 20 Claims |
1. An integrated circuit assembly, comprising:
an electronic substrate;
at least one integrated circuit device electrically attached to the electronic substrate;
a mold material layer abutting the electronic substrate and substantially surrounding the at least one integrated circuit device; and
at least one structure within the mold material layer, wherein the at least one structure comprises a material having a modulus of greater than about 20 gigapascals and a thermal conductivity of greater than about 10 watts per meter-Kelvin.
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