CPC H01L 23/42 (2013.01) [H01L 21/561 (2013.01); H01L 23/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01)] | 30 Claims |
1. An electronic package, comprising:
a plurality of electronic components; and
an encapsulation layer encapsulating the plurality of electronic components, wherein a spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area, and wherein a thermal conductivity of the thermal insulation area is less than 0.02 W/mk.
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