CPC H01L 23/3128 (2013.01) [H01F 27/29 (2013.01); H01L 21/56 (2013.01); H01L 23/3677 (2013.01); H01L 23/49827 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 21/4853 (2013.01)] | 19 Claims |
1. A package structure comprising:
a bottom package comprising:
a substrate having a top surface and a metal contact pad on the top surface; and
a molded layer over the top surface of the substrate, a laser-drilled hole formed at least partially through the molded layer to expose the metal contact pad, wherein an inner wall of the hole comprises the molded layer, the molded layer exposed at the hole; and
an upper device mounted over the molded layer, the upper device having at least one component and a staple lead coupled to and extending away from the at least one component towards the substrate, the staple lead having a thickness and a width greater than the thickness, the staple lead being inserted through the hole to electrically or thermally connect to the metal contact pad, wherein the hole is wider than the staple lead.
|