US 11,749,576 B2
Stacked circuit package with molded base having laser drilled openings for upper package
John D. Brazzle, Tracy, CA (US); Frederick E. Beville, San Jose, CA (US); David R. Ng, San Jose, CA (US); Michael J. Anderson, Peabody, MA (US); and Yucheng Ying, San Jose, CA (US)
Assigned to Analog Devices International Unlimited Company, Limerick (IE)
Filed by Analog Devices International Unlimited Company, Limerick (IE)
Filed on Sep. 25, 2020, as Appl. No. 17/33,245.
Application 17/033,245 is a continuation of application No. PCT/US2019/021908, filed on Mar. 12, 2019.
Application PCT/US2019/021908 is a continuation of application No. 16/152,182, filed on Oct. 4, 2018, granted, now 10,497,635, issued on Dec. 3, 2019.
Claims priority of provisional application 62/648,835, filed on Mar. 27, 2018.
Prior Publication US 2021/0111084 A1, Apr. 15, 2021
Int. Cl. H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01F 27/29 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/3128 (2013.01) [H01F 27/29 (2013.01); H01L 21/56 (2013.01); H01L 23/3677 (2013.01); H01L 23/49827 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 21/4853 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A package structure comprising:
a bottom package comprising:
a substrate having a top surface and a metal contact pad on the top surface; and
a molded layer over the top surface of the substrate, a laser-drilled hole formed at least partially through the molded layer to expose the metal contact pad, wherein an inner wall of the hole comprises the molded layer, the molded layer exposed at the hole; and
an upper device mounted over the molded layer, the upper device having at least one component and a staple lead coupled to and extending away from the at least one component towards the substrate, the staple lead having a thickness and a width greater than the thickness, the staple lead being inserted through the hole to electrically or thermally connect to the metal contact pad, wherein the hole is wider than the staple lead.