	US 11,749,573 B2
	Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity
Johannes Stahr, St. Lorenzen (AT); Gerald Weidinger, Leoben (AT); Gerhard Schmid, Trofaiach (AT); and Andreas Zluc, Leoben (AT)
Assigned to AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on May 25, 2021, as Appl. No. 17/303,264.
Application 17/303,264 is a continuation of application No. 16/436,111, filed on Jun. 10, 2019, granted, now 11,049,778.
Claims priority of application No. 8177090 (EP), filed on Jun. 11, 2018.
Prior Publication US 2021/0280479 A1, Sep. 9, 2021
Int. Cl. H01L 23/13 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01)

CPC H01L 23/13 (2013.01) [H01L 23/49838 (2013.01); H01L 24/83 (2013.01); H01L 2224/83005 (2013.01); H05K 1/185 (2013.01); H05K 1/186 (2013.01)]

9 Claims

1. A component carrier, comprising:

a layer stack comprising at least one electrically insulating layer structure, at least one electrically conductive layer structure and a stepped cavity within the layer stack, the stepped cavity having a wide recess and a narrow recess; and

a stepped component assembly arranged within the stepped cavity;

wherein the stepped component assembly is substantially completely circumferentially surrounded by a fully cured electrically insulating material of the at least one electrically insulating layer structure;

wherein the stepped component assembly comprises a stack of at least two components having a different size and/or a different functionality;

wherein the component carrier comprises at least one of the following features:

(a) at least one of the first and second components is a sensor component;

(b) an upper surface of stepped component assembly is coplanar with an upper surface of the layer stack;

(d) one of the first and second components is or comprises an optical lens.