CPC H01L 21/68735 (2013.01) [C23C 16/45536 (2013.01); H01L 21/02057 (2013.01); H01L 21/02082 (2013.01); H01L 21/67161 (2013.01)] | 20 Claims |
1. A method, comprising:
providing a multi-wafer deposition tool comprising a vacuum enclosure containing a platen laterally surrounding multiple wafer stages and comprising a spindle-blade assembly;
loading wafers onto the multiple stages;
positioning transfer blades of the spindle-blade assembly between neighboring pairs of the wafer stages while depositing a respective material layer on each of the wafers;
transferring the wafers out of the vacuum enclosure; and
performing a chamber clean process while the transfer blades of the spindle-blade assembly are positioned over the multiple wafer stages.
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