US 11,749,554 B2
Multi-wafer deposition tool for reducing residual deposition on transfer blades and methods of operating the same
Makoto Tsutsue, Yokkaichi (JP); and Shunsuke Takuma, Yokkaichi (JP)
Assigned to SANDISK TECHNOLOGIES LLC, Addison, TX (US)
Filed by SANDISK TECHNOLOGIES LLC, Addison, TX (US)
Filed on Nov. 5, 2020, as Appl. No. 17/90,368.
Prior Publication US 2022/0139758 A1, May 5, 2022
Int. Cl. H01L 21/02 (2006.01); H01L 21/687 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68735 (2013.01) [C23C 16/45536 (2013.01); H01L 21/02057 (2013.01); H01L 21/02082 (2013.01); H01L 21/67161 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a multi-wafer deposition tool comprising a vacuum enclosure containing a platen laterally surrounding multiple wafer stages and comprising a spindle-blade assembly;
loading wafers onto the multiple stages;
positioning transfer blades of the spindle-blade assembly between neighboring pairs of the wafer stages while depositing a respective material layer on each of the wafers;
transferring the wafers out of the vacuum enclosure; and
performing a chamber clean process while the transfer blades of the spindle-blade assembly are positioned over the multiple wafer stages.