US 11,749,545 B2
Substrate-floatation-type laser processing apparatus and method for measuring floating height
Daisuke Hayashi, Tokyo (JP); Takahiro Mikami, Tokyo (JP); and Yuki Suzuki, Tokyo (JP)
Assigned to JSW AKTINA SYSTEM CO., LTD, Yokohama (JP)
Filed by JSW AKTINA SYSTEM CO., LTD., Yokohama (JP)
Filed on May 29, 2020, as Appl. No. 16/888,612.
Claims priority of application No. 2019-130992 (JP), filed on Jul. 16, 2019.
Prior Publication US 2021/0020481 A1, Jan. 21, 2021
Int. Cl. H01L 21/67 (2006.01); B65G 19/02 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67259 (2013.01) [B65G 19/02 (2013.01); H01L 21/67115 (2013.01); H01L 21/02675 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate-floatation-type laser processing apparatus comprising:
a floating stage configured to float and convey a substrate;
a floating-height measurement apparatus configured to measure a floating height of the substrate in the floating stage, the floating height being a distance between a top surface of the floating stage and a bottom surface of the substrate in the floating stage; and
a controller to which the measured floating height is input from the floating-height measurement apparatus, the controller being configured to determine a difference between the measured floating height and a preset target value, wherein
a distance along a vertical axis between the floating-height measurement apparatus and the substrate in the floating stage is automatically adjusted based on the determined difference by moving the floating-height measurement apparatus along the vertical axis,
wherein the distance between the floating-height measurement apparatus and the substrate is adjusted so as to make the floating height larger than the preset target value when the difference is negative, and so as to make the floating height smaller than the preset target value when the difference is positive.