US 11,749,542 B2
Apparatus, system, and method for non-contact temperature monitoring of substrate supports
Bhaskar Prasad, Jamshedpur (IN); Kirankumar Neelasandra Savandaiah, Bangalore (IN); Thomas Brezoczky, Los Gatos, CA (US); and Srinivasa Rao Yedla, Bangalore (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 27, 2020, as Appl. No. 16/939,629.
Prior Publication US 2022/0028712 A1, Jan. 27, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 22/12 (2013.01); H01L 21/6833 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a thermal processing chamber defining a processing volume;
a substrate support within the processing volume, the substrate support comprising a substrate interfacing surface and a back surface;
a pedestal hub removably coupled to the substrate support and defining at least a portion of a hub volume, wherein:
the pedestal hub comprises a set of contact pins disposed on a top surface of the pedestal hub,
the back surface of the substrate support comprises a set of contact terminals configured to be detachable from the contact pins, and
one or more of the contact terminals and the contact pins comprise a detachable connection region that is configured to align the substrate support to the pedestal hub when the contact terminals of the substrate support are disposed on the contact pins of the pedestal hub:
a viewport coupled to the pedestal hub;
a sensor disposed within the hub volume, the sensor having an input end positioned to receive electromagnetic energy emitted from the back surface of the substrate support through the viewport of the pedestal hub, wherein the substrate support is decoupled from and is positionable in a first direction relative to the sensor and the pedestal hub, wherein the sensor is configured to measure an intensity of the electromagnetic energy entering the sensor and to generate intensity signals;
a processor communicatively coupled to the sensor configured to determine an apparent substrate temperature based on the intensity signals; and
wherein a temperature of the sensor is managed by a cooled housing that surrounds the sensor disposed within the hub volume and a temperature of the viewport is managed using a pressurized gas provided from a gas source.