US 11,749,539 B1
Maskless etching of electronic substrates via precision dispense process
Richard Korneisel, Cedar Rapids, IA (US); Nathaniel P. Wyckoff, Marion, IA (US); Brandon C. Hamilton, Marion, IA (US); Kyle B. Snyder, Marion, IA (US); and Jenny Calubayan, Cedar Rapids, IA (US)
Assigned to Rockwell Collins, Inc., Cedar Rapids, IA (US)
Filed by Rockwell Collins, Inc., Cedar Rapids, IA (US)
Filed on Aug. 26, 2020, as Appl. No. 17/3,667.
Int. Cl. H01L 21/67 (2006.01); H01L 21/306 (2006.01); H01L 21/48 (2006.01)
CPC H01L 21/6708 (2013.01) [H01L 21/30604 (2013.01); H01L 21/4803 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for maskless substrate etching, comprising:
providing a substrate having a surface to be etched, the substrate including at least one embedded electronic device protruding from the surface of the substrate, and the surface of the substrate being free of mask material;
providing a precision dispense apparatus including a precision dispense tool with programmable toolpath capability and precise etchant dispense volume control;
creating a toolpath instruction for etching at least one feature in the surface of the substrate proximate to the at least one embedded electronic device;
programming the precision dispense apparatus to execute the created toolpath instruction; and
causing the precision dispense tool to deposit etchant material directly onto the surface of the substrate, only at a location or locations on the surface of the substrate to be etched proximate to the at least one embedded electronic device, to etch the substrate surface to produce the at least one feature according to the created toolpath instruction.