| CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/14 (2013.01); H01G 4/248 (2013.01)] | 20 Claims |
|
1. A multilayer capacitor comprising:
a body including a stack structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are stacked with one of the plurality of dielectric layers interposed therebetween;
a first external electrode connected to the first internal electrodes, and including a first electrode layer disposed on a first surface of the body which the first internal electrodes contact with, and a second electrode layer including a first plating layer covering the first electrode layer;
a second external electrode connected to the second internal electrodes, and including a third electrode layer disposed on a second surface of the body which the second internal electrodes contact with, and a fourth electrode layer including a second plating layer covering the third electrode layer;
a first insulating coating layer disposed between the first and second electrode layers and between the third and fourth electrode layers, and having a first discontinuous region through which the first plating layer is contact with the first electrode layer or through which the second plating layer is contact with third electrode layer; and
a second insulating coating layer disposed on the body and having a second discontinuous region, the second insulating coating layer exposed from the first and second external electrodes,
wherein one of the first and second insulating coating layers includes an F-based polymer.
|