US 11,749,455 B2
Methods of fabricating ultra-miniature laminated magnetic cores and devices
Ryan K. Cobian, New Brighton, MN (US); Richard H. Jackson, Plymouth, MN (US); and Scott B. Conklin, Prior Lake, MN (US)
Assigned to BH Electronics, Inc., Burnsville, MN (US)
Filed by BH Electronics, Inc., Burnsville, MN (US)
Filed on Jan. 10, 2022, as Appl. No. 17/571,886.
Prior Publication US 2023/0223190 A1, Jul. 13, 2023
Int. Cl. H01F 7/06 (2006.01); H01F 41/02 (2006.01); G03F 7/00 (2006.01); H01F 1/147 (2006.01)
CPC H01F 41/0246 (2013.01) [G03F 7/0017 (2013.01); H01F 1/147 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A method of fabricating a laminated magnetic core that includes a conductive layer, a magnetic layer, and an insulting-sealant layer, comprising:
fabricating a magnetic-core mold on a surface of a substrate, the magnetic-core mold including a first wall portion having a first sidewall, a second wall portion having a second sidewall, the second sidewall located opposite the first sidewall, and a top portion, the first and second sidewalls and a portion of the surface of the substrate defining a mold cavity having a bottom width that is greater than a top width, the first and second sidewalls connecting the top portion of the mold to the surface of the substrate;
depositing a conductive seed material on the mold top portion and on a portion of the surface of the substrate so as to form a conductive layer of the laminated magnetic core, wherein the conductive seed material is directed toward the mold top portion and the portion of the surface of the substrate, at an angle of incidence that substantially prevents deposition of the conductive seed material on the first and second sidewalls;
forming a magnetic layer on a portion of the conductive layer that is formed on the portion of the surface of the substrate; and
forming an insulating-sealing layer on the magnetic layer, thereby forming the laminated magnetic core having a first lamination layer that includes the conductive layer, the magnetic layer and the insulating-sealing layer.