US 11,749,300 B2
Adhesive for processing a microelectronic substrate, and related methods
Zubair Ahmed Khan, Villa Park, IL (US); Dat Quach, Savage, MN (US); Andrew Habermas, Bloomington, MN (US); and Joel William Hoehn, Hudson, WI (US)
Assigned to Seagate Technology LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Cupertino, CA (US)
Filed on Oct. 23, 2019, as Appl. No. 16/661,564.
Application 16/661,564 is a division of application No. 15/799,264, filed on Oct. 31, 2017, granted, now 10,465,099.
Claims priority of provisional application 62/417,641, filed on Nov. 4, 2016.
Prior Publication US 2020/0090687 A1, Mar. 19, 2020
Int. Cl. G11B 5/31 (2006.01); C09J 175/04 (2006.01); C09J 133/10 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); C09J 7/38 (2018.01); B24B 37/04 (2012.01); C09J 175/08 (2006.01)
CPC G11B 5/3169 (2013.01) [B24B 37/048 (2013.01); C09J 7/38 (2018.01); C09J 133/10 (2013.01); C09J 175/04 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); C08G 2170/40 (2013.01); C09J 175/08 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2475/00 (2013.01); H01L 2221/68327 (2013.01)] 11 Claims
OG exemplary drawing
 
1. Elastomeric adhesive film comprising adhesive polymer, the adhesive film being useful to adhere a microelectronic device substrate to a carrier during a step of lapping a surface of the microelectronic substrate, the adhesive film having:
an elastic modulus in a range from 100 to 500 kilopascals measured at 25 degrees Celsius,
a Tan Delta in a range from 0.05 to 0.2 measured at 25 degrees Celsius.