CPC G11B 5/3169 (2013.01) [B24B 37/048 (2013.01); C09J 7/38 (2018.01); C09J 133/10 (2013.01); C09J 175/04 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); C08G 2170/40 (2013.01); C09J 175/08 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2475/00 (2013.01); H01L 2221/68327 (2013.01)] | 11 Claims |
1. Elastomeric adhesive film comprising adhesive polymer, the adhesive film being useful to adhere a microelectronic device substrate to a carrier during a step of lapping a surface of the microelectronic substrate, the adhesive film having:
an elastic modulus in a range from 100 to 500 kilopascals measured at 25 degrees Celsius,
a Tan Delta in a range from 0.05 to 0.2 measured at 25 degrees Celsius.
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