US 11,747,721 B2
Method of forming shape on mask based on deep learning, and mask manufacturing method using the method of forming the shape on mask
Useong Kim, Hwaseong-si (KR); Mincheol Kang, Hwaseong-si (KR); and Woojoo Sim, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd.
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 21, 2021, as Appl. No. 17/154,279.
Claims priority of application No. 10-2020-0094795 (KR), filed on Jul. 29, 2020.
Prior Publication US 2022/0035236 A1, Feb. 3, 2022
Int. Cl. G03F 7/20 (2006.01); G06N 3/08 (2023.01); G03F 1/36 (2012.01); G03F 7/00 (2006.01); H01L 21/027 (2006.01)
CPC G03F 1/36 (2013.01) [G03F 7/70308 (2013.01); G03F 7/70441 (2013.01); G06N 3/08 (2013.01); H01L 21/027 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a mask, the method comprising:
obtaining first images by performing rasterization and image correction on shapes on the mask corresponding to first patterns on a wafer;
obtaining second images by applying a transformation to the shapes on the mask;
performing deep learning based on a transformation relationship between ones of the first images and ones of the second images corresponding to the first images;
forming a target shape on the mask corresponding to a target pattern on the wafer, based on the deep learning; and
manufacturing the mask based on the target shape on the mask,
wherein the image correction comprises correcting the mask into a mask image corresponding to a required target pattern.