US 11,747,554 B2
Carrier based laser assembly and method of assembly thereof with photonic integrated circuit
Ryan Murray Hickey, Stittsville (CA); Douglas J. S. Beckett, Kanata (CA); and Jeffrey Otha Hutchins, Sunnyvale, CA (US)
Assigned to RANOVUS INC., Kanata (CA)
Filed by RANOVUS INC., Kanata (CA)
Filed on May 18, 2021, as Appl. No. 17/323,406.
Claims priority of provisional application 63/029,031, filed on May 22, 2020.
Prior Publication US 2021/0364694 A1, Nov. 25, 2021
Int. Cl. G02B 6/12 (2006.01)
CPC G02B 6/12 (2013.01) [G02B 2006/12121 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A device comprising:
a photonic integrated circuit (PIC) including a waveguide, an input portion to the waveguide; and a cavity, the input portion located at an interior edge of the cavity; and
a laser device comprising:
a carrier comprising:
a first side, a second side opposing the first side, and an edge joining the first side and the second side; through-carrier vias (TCVs) from the first side to the second side, the TCVs including electrical connections therethrough; first electrical contacts for the electrical connections at the first side; and second electrical contacts for the electrical connections at the second side; and
a laser attached to the second side of the carrier, the laser comprising:
a body supporting components of the laser; a lasing device configured to produce light, the lasing device located at a respective side of the body attached to the second side of the carrier;
respective electrical connections from the second electrical contacts to the lasing device; and
a protruding region of the body protruding the edge of the carrier, the body otherwise having a smaller footprint than the carrier; and
an output portion and a respective waveguide configured to convey light from the lasing device out of the laser, the output portion located at the protruding region of the body,
the body located in the cavity of the PIC, with the output portion and the respective waveguide respectively aligned with the input portion and the waveguide of the PIC, the carrier attached to the PIC, the carrier supporting the body in the cavity,
wherein the protruding region is located in the cavity, and the protruding region comprises a visible region that includes the output portion, the visible region being visible in the cavity adjacent the input portion of the PIC.