CPC G01R 31/2884 (2013.01) [H01L 23/481 (2013.01); H01L 23/5227 (2013.01); H01L 25/0655 (2013.01)] | 20 Claims |
1. An integrated circuit device including a plurality of layers, the integrated circuit device comprising:
a power terminal configured to accept a source voltage to be supplied;
a power via connected to the power terminal passing through at least one of the plurality of layers;
a plurality of inductive vias disposed about said power via and passing through at least one of said plurality of layers;
a plurality of wirings connected to ends of at least some of said plurality of inductive vias and configured to form with said inductive vias a coil wound in a toroidal form around said power via; and
a plurality of test terminals, each configured accept a voltage induced in said coil to be output externally of the integrated circuit device, in response to the supply of the source voltage to the power via.
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