US 11,747,265 B2
Structural electronics wireless sensor nodes
Brian L. Wardle, Lexington, MA (US); Yosef Stein, Sharon, MA (US); Estelle Cohen, Chestnut Hill, MA (US); and Michael Murray, Windham, NH (US)
Assigned to Analog Devices, Inc., Wilmington, MA (US); and Massachusetts Institute of Technology, Cambridge, MA (US)
Filed by Analog Devices, Inc., Wilmington, MA (US); and Massachusetts Institute of Technology, Cambridge, MA (US)
Filed on Mar. 9, 2022, as Appl. No. 17/690,596.
Application 17/690,596 is a continuation of application No. 16/900,159, filed on Jun. 12, 2020.
Application 16/900,159 is a continuation in part of application No. PCT/US2018/065422, filed on Dec. 13, 2018.
Claims priority of provisional application 62/598,425, filed on Dec. 13, 2017.
Claims priority of provisional application 62/598,430, filed on Dec. 13, 2017.
Claims priority of provisional application 62/598,428, filed on Dec. 13, 2017.
Claims priority of provisional application 62/598,416, filed on Dec. 13, 2017.
Prior Publication US 2022/0196542 A1, Jun. 23, 2022
Int. Cl. G01N 27/04 (2006.01); G01N 27/22 (2006.01); G01N 17/04 (2006.01)
CPC G01N 17/04 (2013.01) [G01N 27/04 (2013.01); G01N 27/22 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multi-layer structural material, comprising:
a first layer of composite material comprising an insulating matrix and a first plurality of elongated carbon nanotubes (CNTs) embedded in the insulating matrix, wherein the first plurality of elongated CNTs form a first circuit component;
a second layer of composite material stacked on top of the first layer of composite material and comprising an insulating matrix and a second plurality of elongated CNTs embedded in the insulating matrix, wherein the second plurality of elongated CNTs form a second circuit component; and
a third plurality of elongated CNTs penetrating into the first layer and the second layer and electrically coupling the first circuit component and the second circuit component,
wherein the first, second, and third pluralities of CNTs in combination form a structural sensor.