CPC C08G 59/245 (2013.01) [C08G 59/226 (2013.01); C08G 59/50 (2013.01); C08K 5/549 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); C08L 2207/53 (2013.01)] | 16 Claims |
1. An epoxy resin comprising a diamine, a bisphenol-A based epoxy, isooctyl polyhedral oligomeric silsesquioxane in an amount of at least 0.5 percent by weight of the epoxy resin, a holey graphene, and core-shell rubber particles.
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