US 11,746,121 B2
Molybdenum compound and method of manufacturing integrated circuit device using the same
Gyuhee Park, Hwaseong-si (KR); Younjoung Cho, Hwaseong-si (KR); Haruyoshi Sato, Tokyo (JP); Kazuki Harano, Tokyo (JP); and Hiroyuki Uchiuzou, Tokyo (JP)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR); and ADEKA CORPORATION, Tokyo (JP)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 16, 2020, as Appl. No. 17/72,096.
Claims priority of application No. 10-2020-0036442 (KR), filed on Mar. 25, 2020.
Prior Publication US 2021/0300955 A1, Sep. 30, 2021
Int. Cl. C23C 16/40 (2006.01); C07F 11/00 (2006.01); C01G 39/02 (2006.01); C23C 16/34 (2006.01); C01B 21/06 (2006.01)
CPC C07F 11/00 (2013.01) [C01B 21/062 (2013.01); C01G 39/02 (2013.01); C23C 16/34 (2013.01); C23C 16/405 (2013.01)] 20 Claims
 
1. A molybdenum compound represented by the following General Formula (I):

OG Complex Work Unit Chemistry
wherein R1, R2, R3, R4, R5, and R6 are each independently a C1 to C12 alkyl group, a C2 to C12 alkenyl group, a C2 to C12 alkynyl group, or a halogen atom.