CPC B81C 1/00087 (2013.01) [B41J 2/14 (2013.01); B41J 2/162 (2013.01); B41J 2/1629 (2013.01); B81B 1/002 (2013.01); B81B 2201/052 (2013.01); B81B 2203/0353 (2013.01); B81C 2201/0132 (2013.01)] | 17 Claims |
1. An ejection head chip for a fluid ejection device comprising, a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material, wherein the encapsulating material comprises silicon oxide or silicon dioxide derived from a chemical vapor deposition of an organic silicon compound.
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