CPC B81B 3/0067 (2013.01) [B81C 1/00349 (2013.01); B81C 1/00444 (2013.01); B81B 2207/11 (2013.01); B81C 1/00158 (2013.01)] | 15 Claims |
1. A microelectromechanical device, comprising:
a backplane comprising at least two RF conductors;
a plurality of bottom electrodes disposed on the backplane;
a top electrode disposed above and spaced from the backplane;
a beam disposed between the plurality of bottom electrodes and the top electrode, the beam movable between the at least two RF conductors and the top electrode;
a first base layer and a second base layer disposed on the backplane and spaced from the beam;
a first stack disposed on the first base layer; and
a second stack disposed on the second base layer, wherein the first and second stacks are unaligned with the at least two RF conductors.
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