US 11,745,657 B2
Vehicular camera with PCB focus tuning
Yuesheng Lu, Farmington Hills, MI (US); and Steven V. Byrne, Goodrich, MI (US)
Assigned to Magna Electronics Inc., Auburn Hills, MI (US)
Filed by Magna Electronics Inc., Auburn Hills, MI (US)
Filed on Oct. 24, 2022, as Appl. No. 18/48,887.
Application 18/048,887 is a continuation of application No. 17/248,418, filed on Jan. 25, 2021, granted, now 11,479,174.
Application 17/248,418 is a continuation of application No. 16/451,179, filed on Jun. 25, 2019, granted, now 10,899,275, issued on Jan. 26, 2021.
Claims priority of provisional application 62/711,657, filed on Jul. 30, 2018.
Claims priority of provisional application 62/696,502, filed on Jul. 11, 2018.
Claims priority of provisional application 62/690,527, filed on Jun. 27, 2018.
Prior Publication US 2023/0074036 A1, Mar. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B60Q 9/00 (2006.01); B60R 1/12 (2006.01); G08G 1/16 (2006.01); B60S 1/56 (2006.01); G01J 1/42 (2006.01); B60R 11/04 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)
CPC B60Q 9/008 (2013.01) [B60R 1/12 (2013.01); B60R 11/04 (2013.01); B60S 1/56 (2013.01); G01J 1/4204 (2013.01); G08G 1/167 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A vehicular camera, the vehicular camera comprising:
a lens assembly having at least one lens;
a circuit board having a first planar side and a second planar side opposite the first planar side and separated from the first planar side by a thickness dimension of the circuit board, the circuit board having a first coefficient of thermal expansion (CTE);
an imager disposed at the first planar side of the circuit board, wherein the imager comprises a CMOS imaging array having at least one million photosensor elements arranged in columns and rows;
wherein the at least one lens of the lens assembly is aligned with the imager;
a bend-countering element disposed at the second planar side of the circuit board, the bend-countering element having a second CTE that is greater than the first CTE of the circuit board;
wherein the bend-countering element functions to counter temperature-induced bending of the circuit board; and
wherein, with the vehicular camera disposed at a vehicle, temperature-induced bending of the bend-countering element is in an opposite direction from temperature-induced bending of the circuit board.