US 11,745,482 B2
Fluororesin substrate laminate
Kosuke Murai, Tokyo (JP); Takao Tanigawa, Tokyo (JP); Minoru Kakitani, Tokyo (JP); Makoto Yanagida, Tokyo (JP); and Mami Shimada, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
Filed on Oct. 27, 2020, as Appl. No. 17/81,090.
Claims priority of application No. 2019-195963 (JP), filed on Oct. 29, 2019.
Prior Publication US 2021/0187923 A1, Jun. 24, 2021
Int. Cl. B32B 27/32 (2006.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); C09J 7/24 (2018.01); C09J 7/30 (2018.01); C09J 139/04 (2006.01)
CPC B32B 27/322 (2013.01) [B32B 7/12 (2013.01); B32B 15/085 (2013.01); C09J 7/241 (2018.01); C09J 7/30 (2018.01); C09J 139/04 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2307/538 (2013.01); B32B 2457/08 (2013.01); C09J 2301/30 (2020.08); C09J 2427/006 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A fluororesin substrate laminate for a high-frequency circuit,
the fluororesin substrate laminate comprising a fluororesin substrate and an adhesive layer provided on the fluororesin substrate,
wherein the fluororesin substrate has
a dielectric loss tangent measured at a frequency of 10 GHz and a measurement temperature of 25° C. of 0.0010 to 0.0020, and
a coefficient of thermal expansion of 30 ppm/° C. or less in a direction of the fluororesin substrate,
wherein the fluororesin substrate has a thickness of 120 μm to 12700 μm, and
wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.