US 11,745,406 B2
Film forming apparatus
Katsuyuki Nakano, Kanagawa (JP)
Assigned to SUMITOMO HEAVY INDUSTRIES MODERN, LTD., Tokyo (JP)
Filed by SUMITOMO HEAVY INDUSTRIES MODERN, LTD., Kanagawa (JP)
Filed on Aug. 27, 2018, as Appl. No. 16/113,329.
Application 16/113,329 is a continuation of application No. PCT/JP2017/012369, filed on Mar. 27, 2017.
Claims priority of application No. 2016-063515 (JP), filed on Mar. 28, 2016.
Prior Publication US 2018/0361647 A1, Dec. 20, 2018
Int. Cl. B29C 48/92 (2019.01); B29C 48/10 (2019.01); B29C 48/08 (2019.01); B29C 48/00 (2019.01); B29C 48/32 (2019.01); B29C 48/88 (2019.01); B29C 48/325 (2019.01); B29C 48/28 (2019.01); B29L 23/00 (2006.01)
CPC B29C 48/92 (2019.02) [B29C 48/0018 (2019.02); B29C 48/08 (2019.02); B29C 48/10 (2019.02); B29C 48/28 (2019.02); B29C 48/32 (2019.02); B29C 48/325 (2019.02); B29C 48/913 (2019.02); B29C 2948/92152 (2019.02); B29C 2948/92647 (2019.02); B29L 2023/001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A film forming apparatus comprising:
a die device comprising:
a discharge port that is configured to extrude, when a molten material flows through the discharge port, the molten material, and
a plurality of adjustment portions that surround, in a top view of the die device, the discharge port;
a controller configured to control the adjustment portions; and
a thickness measurement device configured to measure a thickness of each of a plurality of divided sections of a film formed by solidifying the molten material;
wherein the adjustment portions are configured to adjust a width of the discharge port, and
the controller is configured to set target thicknesses for the divided sections that are different depending on the thickness of each of the divided sections measured by the thickness measurement device.