CPC B24B 7/228 (2013.01) [B24B 55/02 (2013.01)] | 6 Claims |
1. A grinding apparatus of a composite substrate, comprising:
a vacuum chuck mechanism for mounting and rotating the composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode;
a fixed abrasive wheel mechanism for grinding the composite substrate mounted on the vacuum chuck while rotating;
a grinding water supply mechanism for supplying water to a contacting part between the composite substrate and the fixed abrasive wheel; and
a high-pressure water supply mechanism for supplying high-pressure water from a high-pressure water supply nozzle to both of a contacting part and a non-contacting part between the fixed abrasive wheel and the composite substrate,
wherein the high-pressure water supply nozzle has a mechanism for swinging at a speed of from 1 to 20 mm/sec and a width of from 1 to 10 mm.
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