US 11,745,299 B2
Grinding method of composite substrate including resin and grinding apparatus thereof
Eiichi Yamamoto, Annaka (JP); Takahiko Mitsui, Annaka (JP); Tsubasa Bando, Annaka (JP); and Satoru Ide, Annaka (JP)
Assigned to OKAMOTO MACHINE TOOL WORKS, LTD., Gunma (JP)
Filed by OKAMOTO MACHINE TOOL WORKS, LTD., Annaka (JP)
Filed on Dec. 10, 2019, as Appl. No. 16/708,528.
Claims priority of application No. 2018-238095 (JP), filed on Dec. 20, 2018.
Prior Publication US 2020/0198083 A1, Jun. 25, 2020
Int. Cl. B24B 7/22 (2006.01); B24B 55/02 (2006.01)
CPC B24B 7/228 (2013.01) [B24B 55/02 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A grinding apparatus of a composite substrate, comprising:
a vacuum chuck mechanism for mounting and rotating the composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode;
a fixed abrasive wheel mechanism for grinding the composite substrate mounted on the vacuum chuck while rotating;
a grinding water supply mechanism for supplying water to a contacting part between the composite substrate and the fixed abrasive wheel; and
a high-pressure water supply mechanism for supplying high-pressure water from a high-pressure water supply nozzle to both of a contacting part and a non-contacting part between the fixed abrasive wheel and the composite substrate,
wherein the high-pressure water supply nozzle has a mechanism for swinging at a speed of from 1 to 20 mm/sec and a width of from 1 to 10 mm.