US 11,745,292 B1
Method of processing glass panel
Sung Soo Park, Yongin-si (KR); and Hong Jin Park, Anyang-si (KR)
Assigned to JOONGWOO NARA CO., LTD., Ansan-si (KR); and BSP CO., LTD., Anyang-si (KR)
Filed by JOONGWOO NARA CO., LTD., Ansan-si (KR); and BSP CO., LTD., Anyang-si (KR)
Filed on Nov. 21, 2022, as Appl. No. 17/991,773.
Claims priority of application No. 10-2022-0129583 (KR), filed on Oct. 11, 2022.
Int. Cl. B23K 26/384 (2014.01); B23K 26/38 (2014.01); B23K 26/362 (2014.01); B23K 26/402 (2014.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01)
CPC B23K 26/38 (2013.01) [B23K 26/362 (2013.01); B23K 26/402 (2013.01); B23K 2101/36 (2018.08); B23K 2103/54 (2018.08)] 10 Claims
OG exemplary drawing
 
1. A method of processing a glass panel comprising a glass substrate, a display layer laminated on an upper surface of the glass substrate to display an image, and a protective layer laminated on an upper surface of the display layer to protect the display layer from an etchant, the method comprising:
a first deformed portion formation step in which, in order to form a via-hole in the glass substrate, a first deformed portion is formed to a first depth from the upper surface of the glass substrate through irradiation with a laser beam along a planned via-hole line while allowing a first non-deformed portion not irradiated with the laser beam to be formed between the first deformed portion and a lower surface of the glass substrate;
a second deformed portion formation step in which, in order to cut the glass substrate into unit cells, a second deformed portion is formed to a second depth in the glass substrate through irradiation with a laser beam along a planned cutting line; and
an etching step in which the glass panel with the first deformed portion and the second deformed portion formed therein is etched such that etching of the glass substrate along the planned cutting line is completed before completion of etching of the glass substrate along the planned via-hole line,
wherein the second depth of the second deformed portion is greater than the first depth of the first deformed portion.